PROJECT

Realtime ECG analyzer with PicoScope

Realtime Heart rate visualization for DIY biofeedback system (2020)

High-throughput microfluidic printer

Using membrame type PDMS template to improve a speed of permeation-based printing. (2019)

MEMS-based non-contact voltage sensor

Multi-resonance oscillator to overcome soft-hard spring effect.(2019)

Portable Geiger counter

Random generator based on radio active decay of Americium (2018)

Plasma synthesizer

5kV spark sound generator whose sound can be tuned by PWM signal. (2018)

Six channel phased pulse generator

Pulser for ultrasonic phased array experiments. (2017)

Flexible UWB antenna

Flexible and "potentially" stretchable antenna for low-cost tumor detection. (2017)

Mirowave Doppler heart beat detection

Non contact heart beat detection using Doppler radar. (2017)

high power flash

DIY Xenon flash lamp for flash sintering of Ag ink. Intensity is 300mJ/cm^2. (2016)

1D Ray tracer

Ray tracer with Monte-carlo simulation to evaluate optical property of nano composite polymer film. (2016)

Noise machine for Autistic kids

Portable noise machine for autistic kids to relief a hyper-responsive to ambient noise. (2016)

Ocean pollusion sensing

Optical particle detector in the water for oil leak detection using backscattering of light. (2015)

Energy saving film

All printable electrochromic device using nano-crystal tungsten trioxide (c-WO3). (2015)

Remote pipeline repairing

Showed the novel repairing technology using self-reactive micro particle to repair cracks. (2013)

Tactile sensor network system

Nerve-mimicking serial bus network for scalability (2013)

MEMS-CMOS integrated tactile sensor

Pressure sensor with internal intelligence.(2011)

Carbon nanotube quantum dot on 2DEG

Quantum tunneling of single electron is detected by ultra sensitive quantum sensor integrated near the carbon nanotube quantum dot (2008)

Measurement Automation for Quantum physics

Labview software to automate measurement of coulomb oscillation.(2006)

Homebrew operating system

DIY OS for Intel 486 CPU with original file system, works in 16 and 32 bit mode.(2005)

SKILL

System design & Prototyping

Hardware, software and firmware

Lathe to Focuced Ion Beam

Sensor System

Wearable device (Lithium battery management, Low power design (few mW), Bluetooth Low Energy), Serial networked tactile sensor.
Design and Development of electro-mechanical test system for MEMS device composed of mechanical actuator (motor and pneumatic), firmwares (FPGA, microcontroller), data transmission (GPIB, RS232C and USB) and original software (C, C# and LabVIEW).

Electronics

Analog circuit (voltage and current amplifier using op-amps, power supply, impedance conversion and matching, high voltage (~5kV), and high frequency (RF,GHz)).
Digital circuit (FPGA (Altera), Microprosessor(Atmel and Cypress), digital interfaces, LCD display, and logic circuits (TTL)).

Mechanics

Mechanical design of mechanical parts (vacuum chuck for Wafer, linear guide, etc) and Machining skill (drill, lathe, mill, sander, welder, and laser cutter).

Computer aided engineering

20+ years experience

Computer-Physics interface

Analog to Digital interface (I2C and UART with Microcontroller and FPGA) and Digital to Computer interface (GPIB, RS232C and USB)
Measurement automation (GPIB network with self-made software), high speed data aquipsion (50MSps by FPGA), and signal processing (Frequency domain, Statistics, peak detection and Graph plot).

Simulation

Finite Element Method simulation (Electromechanical, Acoustic, Thermal, and Electromagnetical, RF, mechanical. with COMSOL and ANSYS).
Cirucit simulation using LTspice (analog circuits) and Model Sim (RTL simulation).
Numerical calculation using C, Python and MATLAB (mechanical vibration, sensor network simulation, optical ray tracing).

Computer assisted design

AutoCAD and layout editor for photo mask design, Solidworks for mechanical design, KiCAD and EAGLE for PCB design.

General Coding skill

C, C++, C#, Verilog for FPGA, Assembly language, LabVIEW, Python, MATLAB, and R.

Nano / Microfabrication

15+ years hands-on experience

Front-end and Back-end

MEMS-CMOS integration and WLP

Microfabrication process

Front-end: Wafer cleaning (RCA, pre bonding and post CMP), Coating (spin, spray, dip and laminate), photolithography (SUSS/EVG contact aligner and JEOL electron beam), dry etching (RIE, XeF2), wet etching(TMAH, KOH and metals), PVD (Al, Ti, Cr, Ni, Cu, Ge, Pt, Au), CVD (TEOS-SiO2, SiN) and thermal process (oxidation, drivein, polymer cure).
Back-end: Through Silicon Via forming (TSV first and last), wafer bonding (Adhesive, Au-Au and Anodic), wafer thinning(CMP, back grinding, stress relief), electroplating (Cu, Au and Ni), Dicing(Si, LSI, bonded wafer and Ceramic) and wire bonding.

Evaluation

Evaluation of failures (residue, adhesion, stress) and optimization of process conditions (process gas, masking material, surface cleanness) of micro fabrication.
Microscopes (optical, infrared for bonding, SEM, AFM, FIB, X-ray CT), EDX, FT-IR, shear force and bonding streng tester.
Laboratory instrument (oscilloscope, impedance analyzer, vector network analyzer, lock-in ampliﬁer, signal generator, semiconductor analyzer, LSI tester, and wafer prober)

And Unique skills!

Practical experience in process integration and optimization for wafer stacked devices (10 masks and 62 process steps)
Practical knowledge of vacuum and plasma system (pressure gauges, leak detection, RF circuit for plasma, etc), Gas and pneumatic system (Swegelock, VCR, NPT, Needle valve, filter and mass flow controller).

Papers

C. Wang, B. Qi, M. Lin, Z.i Zhang, M. Makihata, B. Liu, S.i Zhou, Y. Huang, H. Hu, Y. Gu, Y. Chen, Y. Lei, T. Lee, S. Chien, K. Jang, E. B. Kistler and S. Xu, "Continuous monitoring of deep-tissue haemodynamics with stretchable ultrasonic phased arraysl", Nature Biomedical Engineering volume 5, pages749–758 (2021)
M. Makihata and A. P. Pisano, "High-throughput Microstructure Printer Using Inflatable Thin Membrane with Microchannel", The International Journal of Advanced Manufacturing Technology volume 103, pages1709–1719 (2019)
M. Makihata, K. Matsushita, and A. P. Pisano, "MEMS-based non-contact voltage sensor with multi-mode resonance shutter", Sensors and Actuators A: Physical Volume 294, Pages 25-36 (2019).
C. Wang, X. Li , H. Hu, L. Zhang, Z. Huang, Z. Yin, B. Huang, H. Gong, S. Bhaskaran, Y. Gu, M. Makihata, Y. Guo, Y. Lei, Y. Chen, C. Wang, Y. Li, T. Zhang, Z. Chen, A. P. Pisano, L. Zhang, Q. Zhou and S. Xu, "Central blood pressure waveform monitoring by conformal ultrasonic devices", Nature Biomedical Engineering, Volume 2, Pages 687–695 (2018).
M. Makihata, M. Muroyama, S. Tanaka, T. Nakayama, Y. Nonomura, and M. Esashi, "Design and fabrication technology of low-profile tactile sensor with digital interface for whole body robot skin", Sensors (Basel, Switzerland), 18(7), 2374, Pages 1-14, (2018).
N. Terasaki, K. Dorsey, M. Makihata, and A. P. Pisano, "Micro printing using microfluidics for printed biodegradable devices in trillion sensing", ECS Trans. , Volume. 75, No. 41, Pages. 13–19 (2017).
M. Makihata, M. Muroyama, Y. Nakano, T. Nakayama, U. Yamaguchi, H. Yamada. Y. Nonomura, H. Funabashi, Y. Hata, S. Tanaka, and M. Esashi, "Development of a 35Mbps Asynchronous Bus Based Communication System for Tactile Sensors", IEEJ Transactions on Sensors and Micromachines, Volume 134, No. 9, Pages 300-307, (2014).
M. Muroyama, M. Makihata, S. Tanaka, T. Kojima, Y. Nakano, T. Bartley, T. Nakayama, U. Yamaguchi, H. Yamada, Y. Nonomura, Y. Hata, H. Funabashi, and M. Esashi, "Practical Application of MEMS-CMOS integration technology: tactile sensor network", Interlab , No. 110, Pages 1-7 , (2014).
M. Makihata, M. Muroyama, Y. Nakano, T. Nakayama, U. Yamaguchi, H. Yamada, Y. Nonomura, H. Funabashi, Y. Hata, S. Tanaka, and M. Esashi, "Testing, Repairing and Packaging Technology for the CMOS-MEMS Integrated Tactile Sensor", IEEJ Transactions on Sensors and Micromachines, Volume 133, No. 6, Pages 243-249, (2013).
M. Makihata, S. Tanaka, M. Muroyama, S. Matsuzaki, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, and M. Esashi, "Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection", Sensors and Actuators A: Physical, Volume 188, Pages 103-110, (2012).
Y. Nakano, M. Muroyama, M. Makihata, S. Tanaka, S. Matsuzaki, H. Yamada, T. Nakayama, U. Ymaguchi, Y. Nonomura, M. Fujiyoshi, and M. Esashi, "A Simulated Network System Prototype for Development of a Networked Tactile Sensor System with Integrated MEMS-LSI Tactile Sensors", IEEJ Transactions on Sensors and Micromachines, Volume 132, No. 9, Pages 288-295, (2012).
M. Makihata, S. Tanaka, M. Muroyama, S. Matsuzaki, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, and M. Esashi, "Adhesive wafer bonding using a molded thick benzocyclobutene layer for wafer-level integration of MEMS and LSI”, Journal of Micromechanics and Microengineering, Volume 21, Pages 85002-85008, (2011).
M. Muroyama, M. Makihata, Y. Nakano, S. Matsuzaki, H. Yamada, U. Yamaguchi , T. Nakayama, Y. Nonomura, M. Fujiyoshi, S. Tanaka, and M. Esashi, "Development of an LSI for Tactile Sensor Systems on the Whole-Body of Robots”, IEEJ Transactions on Sensors and Micromachines, Volume 131, No. 8, Pages 302-309, (2011).
T. Takahashi, M. Makihata, M. Esashi, and S. Tanaka, "Evaluation and Application of Resist for Alkaline Wet Etchinig", IEEJ Transactions on Sensors and Micromachines, Volume 130, No.9, Pages 421-425, (2010).

M. Makihata

(2009)

Conference

M. Makihata,, B. Eovino, X. Jiang, A. Toor, K. Dorsey, and A. P. Pisano, "Non-invasive and remote pipeline rehabilitation technology using reactive and magnetic particles”, Extended Abstract of ASCE Pipelines conference 2015, Pages 1-9, (2015).
Y. Hata, Y. Nonomura, Y, H. Funabashi,T. Akashi, M. Fujiyoshi, Y. Omura,T. Nakayama,U. Yamaguchi, H. Yamada, S. Tanaka, H. Fukushi, M. Muroyama, M. Makihata, and M. Esashi, "An SOI Tactile Sensor with a quad seesaw electrode for 3-axis complete differential detection", 2014 IEEE 27th international conference on micro electro mechanical systems (MEMS), Pages 709-712, (2014).
M. Makihata, M. Muroyama, Y. Nakano, S. Tanaka, T. Nakayama, U. Yamaguchi, H. Yamada, Y. Nonomura, H. Funabashi,Y. Hata, and M. Esashi, "A 1.7mm$^3$ MEMS-on-CMOS tactile sensor using human-inspired autonomous common bus communication", Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2013 proceedings, Pages 2729-2732, (2013).
M. Makihata, M. Muroyama, Y. Nakano, H. Yamada, T. Nakayama, U. Yamaguchi, Y. Nonomura, H. Funabashi, Y. Hata, S. Tanaka, and M. Esashi, "Development of a High Speed Serial Interface for a Bus Networked Tactile Sensor System”, Proceedings of the 30th Sensor symposium on sensor, micromachines and applied systems, Pages 1-6 (2013).
T. Kojima, M. Makihata, M. Muroyama, T. Nakayama, U. Yamaguchi, H. Yamada, Y. Nonomura, H. Funabashi, Y. Hata, M. Esashi, and S. Tanaka, “Integrated Tactile Sensors Using LSI Diaphragm Structures”, Proceedings of the 30th Sensor symposium on sensor, micromachines and applied systems, Pages 1-5, (2013).
M. Makihata, M. Muroyama, S. Tanaka, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, and M. Esashi, "MEMS-CMOS Integrated Tactile Sensor with Digital Signal Processing for Robot Application”, Material Research Society Symposium Proceedings, Volume. 1427, Pages 1-8, (2012).
M. Makihata, M. Muroyama, Y. Nakano, H. Yamada, T. Nakayama, U. Yamaguchi, Y. Nonomura, H. Funabashi, Y. Hata, S. Tanaka, and M. Esashi "Testing, Repairing and packaging technology for the CMOS-MEMS integrated tactile sensor”, Proceedings of the integrated MEMS symposium 2012, The Japan society of Applied Physics, Pages 85-90, (2012).
M. Makihata, S. Tanaka, M. Muroyama, S. Matsuzaki, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, and M. Esashi, "Integration and packaging technology of MEMS-on-CMOS tactile sensor for robot application using molded thick BCB layer and backside-grooved electrical connection", Solid-State Sensors, Actuators and Microsystems Conference (Transducers), 2011 proceedings Pages 815–818, (2011).
M. Muroyama, Y. Nakano, M. Makihata, S. Tanaka, H. Yamada, T. Nakayama, U. Yamaguchi, Y. Nonomura, H. Funabashi, Y. Hata, and M. Esashi, "A Run-Time Configurable LSI on Asynchronous Serial Communication for Integrated Tactile Sensors", Proceedings of the integrated MEMS symposium 2012, The Japan society of Applied Physics, Pages 91-96, (2012).
M. Makihata, S. Tanaka, M. Muroyama, S. Matsuzaki, H. Yamada, U. Yamaguchi, Y. Nakayama, Y. Nonomura, M. Fujiyoshi, and M. Esashi, "Fabrication of MEMS-CMOS integrated tactile sensor using general-purpose capacitor sense amplifer LSI”, The Papers of Technical Meeting on Sensor and Micromachine, IEE Japan, Volume 19, Pages 21 – 25, (2011).
M. Makihata, S. Tanaka, M. Muroyama, S. Matsuzaki, Y. Nonomura, M. Fujiyoshi, and M. Esashi, "Wafer-level integration and packaging technology for Networked Tactile Sensors”, The Japan society of Applied Physics, Proceedings of Integrated MEMS symposium 2009, Page 19-23, (2009).
T. Takahashi, M. Makihata, M. Esashi, and S. Tanaka, "Evaluation and Application of Resist for Alkaline Wet Etching”, Proceedings of the 26th Sensor symposium on sensor, micromachines and applied systems, Pages 159-163, (2009).
M. Makihata, S. Moriyama, T. Mori, T. Yamaguchi, Y. Aoyagi, and K. Ishibashi, "Mechanism of surface gating to carbon nanotube quantum dots fabricated on a GaAs/AlGaAs 2-dimensional electron gas wafer”, Extended Abstract of The 34th International Symposium on Compound Semiconductors (ISCS2007), Pages 1-3, (2007).

Patent

"Integrated device"
M. Makihata, M. Esashi, S. Tanaka, M. Muroyama, H. Funabashi, Y. Nonomura, Y. Hata, H. Yamada, T. Nakayama, and U. Yamaguchi
US 9478503B2, filed March 30, 2012, and issued October 25, 2016.
"Touch sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, T. nakayama, U. Yamaguchi, and H. Yamada,
US 9215089B2, filed October 14, 2009, and issued December 15,2015.
"Dynamic quantity sensor and dynamic quantity sensor system"
Y. Hata, Y. Nonomura, M. Fujiyoshi, H. Funabashi,T. Akashi, Y. Omura, T. Nakayama, U. Yamaguchi, H. Yamada, S. Tanaka, M. Esashi, M. Muroyama, and M. Makihata,
US 9134189B2, filed November 16, 2012, and issued September 15, 2015.
"Sensor device having electrode draw-out portions through side of substrate"
S. Tanaka, M. Esashi, M. Muroyama, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, T.Nakayama, and U.Yamaguchi,
US 8823114B2, filed October 14, 2009, and issued September 2, 2014.
"Sheet-like tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki ,M. Makihata, Y. Nonomura, M. Fujiyoshi, T. Nakayama, U. Yamaguchi, and H. Yamada,
US 8613231B2, filed October 14, 2009, and issued December 24, 2013.
"Sensor System"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, T. Nakayama, U. Yamaguchi, and H. Yamada,
US 8336399B2, filed October 13, 2010, and issued December 25, 2012.
"Sheet-like tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, T. Nakayama, U. Yamaguchi, and H. Yamada,
EP 2490004B1, filed October 14, 2009, and issued March 23, 2016.
"Dynamic quantity sensor and dynamic quantity sensor system"
Y. Hata, Y. Nonomura, M. Fujiyoshi, H. Funabashi, T. Akashi, Y. Omura, T. Nakayama, U. Yamaguchi, H. Yamada, S. Tanaka, M. Esashi, M. Muroyama, and M. Makihata,
JP 5714648B2, filed May 23, 2013, issued March 20, 2015.
"Tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nakano, Y. Nonomura, M. Fujiyoshi, H. Yamada, Y. Nakayama, U. Yamaguchi, and K. Mima,
JP 5687467B2, filed October 12, 2010, issued January 30, 2015.
"Tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nakano, Y. Nonomura, M. Fujiyoshi, H. Yamada, Y. Nakayama, U. Yamaguchi, and K. Mima,
JP 5687467B2, filed October 12, 2010, issued January 30, 2015.
"Tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, Y. Nakayama, U. Yamaguchi, and H. Yamada,
JP 5650131B2, filed October 14, 2009, and issued November 21, 2014.
"Sheet-like tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, T. Nakayama, U. Yamaguchi, and H. Yamada,
CN 102713546B, filed October 14, 2009, and issued July 9, 2014.
"Sheet-like tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, T. Nakayama, U. Yamaguchi, and H. Yamada,
KR 101353013B1, filed October 14, 2009, and issued January 22, 2014.
"Structure and the fabrication method of sensor device"
S. Tanaka, M. Esashi, M. Muroyama, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, T. Nakayama, U. Yamaguchi, and H. Yamada,
KR 101347768B1, filed May 11, 2012, and issued December 27, 2013.
"Sheet-like tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, Y. Nakayama, U. Yamaguchi, and H. Yamada,
JP 5417454B2, filed October 14, 2009, and issued November 22, 2013.
"Sheet-like tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, T. Nakayama, U. Yamaguchi, and H. Yamada,
TW 1408036, filed May 21, 2010, and issued September 11, 2013.
"Sensor device and method for fabricating sensor device"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, Y. Nakayama, U. Yamaguchi, and H. Yamada,
JP 5328924B2, filed October 13, 2010, and issued August 2, 2013.
"Tactile sensor system"
M. Muroyama, M. Esashi, S. Tanaka, S. Matsuzaki, M. Makihata, Y. Nonomura, M. Fujiyoshi, Y. Nakayama, U. Yamaguchi, and H. Yamada,
JP 4896198B2, filed October 14, 2009, and issued January 6, 2012.

MEMS researcher and engineer

Microfabrication

Tech for people

Hello.

I am electro-mechanical researcher / device system engineer.